Nvidia has announced that it is to invest $5 billion in Intel, becoming one of the tech giant's largest shareholders.

Nexperia has unveiled AEC-Q101 qualified 100 V MOSFETs, in a compact CCPAK1212 (12 x 12 mm) copper-clip packaging.

Grinn, a specialist in the design of advanced IoT and embedded solutions, signs a strategic partnership with MediaTek.

Nordic's new nRF54LM20A is the latest addition to its next-generation nRF54L series of ultra-low power wireless SoCs.

Siemens Digital Industries Software has introduced Tessent AnalogTest software – a solution that looks to reduce pattern ...

TI's C2000 real-time MCUs designed to help engineers design consumer products with improved levels of performance.

Microchip Technology has unveiled a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology.

The UK and the US agree technology pact that looks to boost ties in AI, quantum computing and civil nuclear power.

RANsemi small cell platform has been selected by Tidal Wave for its next-gen industrial private 5G deployments.

Mouser Electronics’ Marie-Pierre Ducharme discusses market conditions with Neil Tyler. Are we seeing a recovery?

Flex Power Modules, a US-based provider of advanced power conversion solutions, is partnering with Renesas to develop a new ...

Security: Unique ID, TRNG, Flash access window, Flash read protection ...