Discover the fundamentals of hybrid relays and explore why they are becoming a go-to choice for engineers and makers alike.

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Microchip’s DualPack 3 IGBT7 power modules come in six variants at 1200 V and 1700 V with current ratings from 300 A to 900 A ...

The IM69D129F low-power MEMS microphone, part of Infineon’s XENSIV lineup, helps extend battery life in portable devices.

Entry-level MCUs in the Renesas RA0L1 group combine low current consumption with capacitive touch sensing for responsive HMIs ...

By modifying structure rather than materials, researchers have developed a much more efficient solar thermoelectric generator ...

Bosch Sensortec, which shipped more than 1 billion MEMS sensors in 2024, is now a 20-year-old outfit with an ambitious goal ...

Here is how designers can break functional systems into sub-functional chiplets and use advanced packaging integration ...

A pre-certified module with edge intelligence, the Digi XBee 3 BLU provides secure Bluetooth LE 5.4 connectivity for ...

Exploring how exploding capacitors in a commercial pressure washer due to a failed diode present serious safety concerns.

High-speed data acquisition is made simple with a 12-bit digitizer that offers up to 10 GSPS sampling rate and 2 Gbyte/s ...

Tektronix high-performance oscilloscope, the 7 Series DPO, is engineered for signal clarity through a high ENOB and low noise ...