A modern approach applies artificial intelligence to accident reconstruction by mining large-scale accident databases ...
To avoid these pitfalls, IP descriptions need to be clear. When structured and easy to exchange, they become a single source ...
Dnotitia’s VDPU IP addresses these challenges at the silicon level. Designed for seamless integration into a System-on-Chip (SoC), the IP optimizes power, performance, and area (PPA) to support vector ...
AI and high-performance computing (HPC) workloads are growing steadily, and the need for establishing high performance and low-latency interconnect links is placing pressure on interconnect technology ...
SMIC is testing a deep-ultraviolet lithography machine made by Shanghai-based start-up Yuliangsheng, the FT reported, citing two people with knowledge of the development. DUV machines are a key ...
RISC-V is the open industry standard Instruction Set Architecture (ISA), bringing new possibilities for innovation to automotive. An ISA is the interface between hardware and software, and the open ...
TSMC brings decades of experience in 12-inch wafer production. Its existing infrastructure, process control, and packaging expertise allow it to treat SiC not just as a material upgrade, but as part ...
Galitzky most recently served as Vice President, Surface Devices and Accessories at Microsoft, where he helped define Microsoft’s edge AI roadmap for consumer devices and its integration into ...
SAN JOSE, CA – Omni Design Technologies, a leader in Wideband Signal Processing™ solutions for the AI data revolution, today announced that it has successfully raised over $35 million in an ...
D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitation.
Covid, AI, and geopolitics reshape chip priorities The Covid-era chip shortages exposed the fragility of a highly concentrated semiconductor supply chain, halting automotive production and rippling ...
TSMC's 2 nm technology is the first to adopt nanosheet transistor structure, and N2P represents the next evolution in the 2 nm family, set to deliver improved performance and power efficiency. The ...
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