The editor allows users to upload their logos, select layouts and colours, and view their packaging designs in real time.

Custom packaging has long been a challenge for operators, often requiring bulk orders, long lead times, or outside design ...

OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

SI Sensors has announced the availability of its next-generation hermetic packaging solutions for all their CMOS image sensor ...