The new SOP Advance(E) package from Toshiba brings lower loss and higher efficiency to industrial equipment, data centers, ...

New turnkey and select service offerings bring trust, clarity, and premium design within reach of UAE homeowners ...

SmashBrand, a U.S.-based brand and packaging design agency, has updated its PREformance Testing Suite in 2025 to reflect new ...

With safety, branding, and environmental impact shaping the future, packaging has become a cornerstone of the cannabis ...

Unilever brand Comfort has unveiled a new look in collaboration with brand design company JDO Global, featuring a new ...

According to its 2024 Sustainability Report, Ferrero designed over 92% of its packaging for recycling in the last fiscal year ...

"Each published package becomes a new distribution vector: as soon as someone installs it, the worm executes, replicates, and ...

As packaging integrates diverse substrates, adhesives, and exotic metals, manufacturers must rethink precision from the ...

The AI revolution in packaging and paper is driving faster, more sustainable innovation while cutting costs across R&D, manufacturing, and customer engagement.

TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

Design-linked incentives are expected to increase 5x to ₹5,000 crore in ISM 2.0. Budget approvals for it are expected by next ...

Thermal modeling uses heat transfer and fluid dynamics equations to estimate how temperature changes within a system over time. This simulation allows packaging designers to predict how a solution ...