Abstract: This article addresses the challenge of modeling the conducted immunity of mixed analog-digital integrated Circuits under electromagnetic interference (EMI). We propose a black-box modeling ...

China's Ministry of Commerce has launched an anti-discrimination investigation into U.S. trade restrictions in the integrated ...

Abstract: For the packaging and integration of millimeter-wave monolithic integrated circuits, a fan-out wafer-level package (FOWLP) technology is developed. TMV arrays and molybdenum copper blocks ...