ROHM has developed new 4-in-1 and 6-in-1 SiC molded power modules in the HSDIP20 package, optimized for PFC and LLC converters in onboard chargers (OBCs) for electric vehicles (xEVs). The lineup ...
Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...
QuickLogic announced its selection by a large multi-national company for eFPGA IP targeting the TSMC N12e, 12nm process. IP delivery for this contract is scheduled for fiscal year 2024. This design is ...
When TSMC started making semiconductor chips, India too had a fab. The difference was India's first fab did not scale and grow. whereas TSMC reached the peaks of foundry technology. India's progress ...
Littelfuse launched IX4352NE, a Low-side SiC MOSFET and IGBT Gate Driver IC specifically designed to drive Silicon Carbide (SiC) MOSFETs and high-power Insulated Gate Bipolar Transistors (IGBTs) in ...
Leading Japan based IDM semiconductor chipmaker Renesas acquired Australia based PCB desing software vendor Altium at approximately A$9.1 billion. Through this acquisition, Renesas to offer its ...
Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...
Littelfuse released the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series. This groundbreaking series of TVS diodes is designed to safeguard ...
ABI Research said the chipset revenues from AI-dedicated silicon for IoT-focused applications reaching over US$7.3 billion by 2030. The trend driving this growth is due to embedded chipset vendors ...
Market Researcher IDC forecasts a significant surge in shipments of AI PCs powered by SoC processors to locally handle generative AI tasks. From an estimated 50 million units in 2024, IDC projects ...
onsemi signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform ...
5G RedCap was finalized in the 3GPP’s Release 17 to provide device OEMs with a migration pathway from 4G LTE to 5G for mid-range devices, whose throughput requirements sit between those of enhanced ...
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