Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

Parallel test is used for nearly every device produced by fabs and OSATs, but it can reduce yield and increase the cost of test boards and operations. This is a well-understood tradeoff for ensuring ...

Elma Bustronic of Fremont, California, a designer and manufacturer of high performance backplanes and system accessories – and which debuted the industry's first VXS Extender Board in January 2006 – ...

Existing test solutions aren’t always suitable for the latest improvements in switching regulator technology. Transient load testing can address these inequities. In response to the recent ...