During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...

Nvidia has reportedly cancelled its first-gen SOCAMM (System-on-Chip Attached Memory Module) rollout and is shifting ...

(MENAFN- GlobeNewsWire - Nasdaq) Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and ...

There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and HPC workloads better than we have been able to do thus far. But, as we were ...

Kioxia Corporation today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) (1) enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the ...

SK Hynix becomes the first company to finish developing HBM4 memory and announces plans for mass production ahead of Samsung and Micron.

SK Hynix becomes the first company to finish developing HBM4 memory and announces plans for mass production ahead of Samsung ...

ESC San Jose, Ca. – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), here unveiled a new development tool that helps developers avoid stack overflow ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...