Samsung Electronics and SK Hynix used this year’s Future of Memory and Storage conference in Santa Clara to lay out competing ...

Thinner dies, more TSV area, thermal dissipation, and limited manufacturing capacity make HBM scaling much more difficult.

Primemas and Micron Technology are working together to address this fundamental infrastructure challenge by pioneering a new paradigm. Rather than forcing expensive server over-provisioning, the Abaco ...

Use left and right arrow keys to seek audio. SK hynix CEO Kwak Noh-Jung has just announced the company's new vision of its "Full Stack AI Memory Creator" at the SK AI Summit 2025 event, hosted in ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. The 2026 IEEE Hot Chips Conference, marked by record attendance, underscored the critical ...

HBMX has added exposure to ChangXin Memory Technologies (CXMT) (Shanghai: 688825), one of the fastest-growing producers in the memory-semiconductor complex at the center of the AI buildout. CXMT lists ...

Use left and right arrow keys to seek audio. Rambus has provided more details on its upcoming HBM4 memory controller, which offers some huge upgrades over current HBM3 and HBM3 memory controllers.