Semiconductor Engineering

Enhancing Test Socket Performance Through Application-Specific Validation And System-Level Per-Pin OQC

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
EDN

Test socket for memory chips comes with a floating guide

Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...
EDN

BGA test socket features precise ball-to-pin alignment

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
Electronic Design

High-Performance Elastomer Socket for 0.5-mm-Pitch BGAs

Ironwood Electronics introduced a new high-performance elastomer socket for 0.5-mm-pitch ball-grid-array (BGA) packages. The CG15-BGA-1003 socket is designed for a 10- x 5.7-mm package size. It ...