Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...
A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.
The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...
Austin, Oct. 20, 2025 (GLOBE NEWSWIRE) -- Power Module Packaging Market Size & Growth Insights: According to the SNS Insider,“The Power Module Packaging Market size was valued at USD 2.53 Billion in ...
DUBLIN--(BUSINESS WIRE)--The "Power Module Packaging Market - Growth, Trends, and Forecast (2019 - 2024)" report has been added to ResearchAndMarkets.com's offering. The power module packaging market ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
Every circuit, from the smallest Internet-of-Things (IoT) home-automation sensor to the largest industrial machine, requires power. The power supply requires effort and board space, but in many ...
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