Background: Glass, 45, has lived in the Chicago area all his life. He has a bachelor`s degree from the Institute of Design at the Illinois Institute of Technology and an MBA in marketing and business ...

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...

Fairchild Capital Partners has acquired Buffalo, New York-based Package Design & Supply Co., Inc, a maker of industrial and business packaging and shipping products and supplies. No financial terms ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

Chip design companies and package assembly houses have no unified signoff verification process to ensure that an IC package meets manufacturability and performance requirements. Packages need a ...