As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory (HBM), a move expected to reshape the global semiconductor equipment ...

Revenue for Q4 2024 was €153.4 million, with a 2% sequential decline and a 3.9% drop year-over-year, due to weaker mainstream assembly markets and lower demand for hybrid bonding and photonics ...

BE Semiconductor is the market leader in the Die Attach semiconductor segment. BESIY has been quite volatile since 2023, torn between investor optimism on the new generation of Chip Bonding and ...

Micro LED has become one of the most anticipated display technologies for consumer products in recent years. Using self-emissive LEDs as pixels, the backlight-free displays combine the contrast-rich ...