Brian Narveson, Independent Consultant and PSMA Board Member, and Greg Evans, CEO, WelComm Inc., and PSMA Marketing Committee, contributed to this article. It’s always been inevitable, that in system ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher ...

Let’s get something straight—packaging isn’t just about protection anymore. It’s about perception. Positioning. And ultimately, performance. If you’re running a product-based business in 2025 and ...

MSI Express, which is backed by HCI Equity Partners, has acquired Power Packaging, a provider of contract packaging and contract manufacturing services. No financial terms were disclosed. Kirkland & ...

German paper and packaging company Palm Group has taken a 50% interest in Power Packaging, which is based in the Czech Republic. According to Palm, the move is intended to broaden its packaging ...