IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

SANTA CLARA, Calif.–Taiwan's Advanced Semiconductor Engineering Inc. (ASE) here today announced it has begun producing packages for image sensor products. The packages from ASE include two types: ...

For over half a century, the semiconductor industry has been governed by a commonly known principle described as Moore’s Law. This “law” predicts that through technological advancement a doubling of ...

Learn how ANSYS simulation software can help accurately predict electromagnetic, thermal and mechanical performance of a PCB. Used for all electrical CAD types including IC packages, touch panel ...