Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Microchip Technology’s MCP3909 energy-measurement IC and the MCP3909 3-Phase Energy Meter Reference Design enable designers to quickly design and develop energy meter designs. The IC combines low ...

Malaysia today launched its second integrated circuit (IC) design park in Cyberjaya, marking another milestone in its bid to ...

CYBERJAYA, Nov 6 (Bernama) -- The launch of the Integrated Circuit (IC) Design Park 2 in Cyberjaya marks a major step forward in Malaysia’s bid to strengthen its position in the global semiconductor ...

SELANGOR’s second integrated circuit (IC) design park, a hub for the state’s growing semiconductor industry, is set to open in Cyberjaya come November. State investment, trade and mobility committee ...