With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

MEMS-based accelerometers are increasingly deployed in harsh environments where mechanical stress is not just expected but constant.

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

Semiconductors are the foundation of modern-day technology, and improving their computing power is at the core of this dynamic industry. However, the mechanical performance also matters: adhesion of ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Cell-to-cell junctions were visualized by ZO1-GFP, and the dynamics of cell junctions were captured by movies. When the cells indicated by * were spontaneously stretched, a continuous belt of cell ...