Thin-film, single- and multi-layer high-density interconnects (HDIs) have been developed that integrate conductor patterns and other passive components to form low-noise products with enhanced signal ...

Scientists have created a process to make patterns in atom-thick layers that combine a conductor -- graphene -- and an insulator -- hexagonal boron nitride. The process may lead to new possibilities ...

At the heart of the motherboards and graphics cards that we review on this site is the printed circuit board (PCB). On one side, you have the cold, hard facts and data of benchmarks and testing. On ...

TDK Corp. has introduced its new PLE856C Series (0.80 x 0.45 x 0.65 mm) of compact thin-film power inductors for wearable devices. Mass production of these new components began in December 2024.