Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...

iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...

The stack of memory chips holds 16GB of memory and takes up the same amount of space formerly required for one chip. Michael Kanellos is editor at large at CNET News.com, where he covers hardware, ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Intel announced that its researchers foresee a way to make chips 10 times ...

In the arena of business ethics, the phrase "do no harm" is central to the ideal of how businesses should conduct themselves. However, in a convoluted way, this same mantra has cast a ...