Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results that support the ...
MASSY, France, Dec. 12, 2017 (GLOBE NEWSWIRE) -- aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via ...
Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. Among the questions ...
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