A hybrid micro-continuum scale simulation reproduces needle-like ablation morphologies in porous carbon heat shield materials ...

A hybrid physics and machine learning framework predicts how continuous carbon fiber prepreg tapes deform during robotic 3D ...

SiC and GaN thermal management relies on multiscale simulation spanning device-level FEA to system-level electro-thermal ...

Blender is shaping modern creative pipelines as 3D animation software becomes faster and more specialized. In 2026, many tools deliver stronger viewport performance optimization, handling massive ...

The companies will develop virtual models, simulation and lithography techniques to address fabrication challenges and prepare the architecture for production.

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

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Dylan Turck is a PC hardware, software, and gaming reporter who loves writing how-to guides and in-depth features on the latest tech products. When he's not shocking himself by pulling electronics ...

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design ...